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Energy Band Diagram of the Electrochemical Corrosion of n-Si(100) in Hf

机译:N-Si(100)在HF中的电化学腐蚀的能带图

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摘要

The energy band diagram resposible for electrochemical etch of n-Si (100) in HF solutions in the absence and presence of illumination was contstructed. This diagram was useful to estimate the activation energy for the photo-electrochemical etching system. Study in kinetics demonstrated that the etching rate of the silicon increases to a maximum with an increase of HF from 0.5 to 2.0 M, then decreases with further increase in HF concentrations. On basis of the energy band diagram established, we discuss the etching mechanism in detail and elucidate the HF concentration effect on the photo-electrochemical etching reaction.
机译:不存在于在不存在和存在照明的情况下在HF溶液中获得N-Si(100)的电化学蚀刻的能带图。该图对于估计光电化学蚀刻系统的激活能量是有用的。动力学中的研究证明,硅的蚀刻速率随比0.5至2.0μm的增加而增加至最大值,然后随着HF浓度的进一步增加而降低。在建立的能带图的基础上,我们详细讨论了蚀刻机制,并阐明了对光电化学蚀刻反应的HF浓度效应。

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