首页> 外文会议>Society of Photo-Optical Instrumentation Engineers Conference on Photon Processing in Microelectronics and Photonics >High-efficiency micro structuring of VUV window materials by laser-induced plasma-assisted ablation (LIPAA) with a KrF excimer laser
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High-efficiency micro structuring of VUV window materials by laser-induced plasma-assisted ablation (LIPAA) with a KrF excimer laser

机译:通过激光诱导的等离子体辅助消融(LIPAA)具有KRF准分子激光的高效微观结构

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We report on the micro structuring of fused silica (a-SiO_2) and calcium fluoride (CaF_2) with a conventional KrF excimer laser (248 nm) by utilization of the effects in the laser-induced plasma-assisted ablation (LIPAA). Mask projection of the UV light is realized onto the rear (instead of the front) side of the UV transparent samples. The plasma generated from a metal target located behind the rear surface of the VUV window effectively assists in the ablation. In the case of fused silica, we obtain high-quality complex micro structures with structure depths even above 500 μm in aspect ratios of 1:5 and better. The ablation rate in fused silica can reach a level as high as 1 μm per pulse with this novel method, demonstrating a remarkable efficiency. While the ablation rate observed for CaF_2 remains at 50 nm per pulse, the up to 100 μm deep micro structures demonstrate an excellent quality without signs of severe cracking or stress outside the mask projected area. This technique permits high-quality micro fabrication of bio-medical, electronic and opto-electronic devices based on oxides and fluorides by use of a conventional UV laser.
机译:通过利用激光诱导的等离子体辅助消融(LiPAA)的效果,通过使用常规KRF准分子激光(248nm)向氟化二氧化硅(A-SiO_2)和氟化钙(CaF_2)的微结构报告。 UV光的掩模投影在UV透明样品的后部(而不是前部)上实现。从位于VUV窗口的后表面后面的金属靶产生的等离子体有效地帮助烧蚀。在熔融二氧化硅的情况下,我们在宽高比的宽度比中获得高质量的复杂微结构,甚至高于500μm,均为1:5,更好。熔融二氧化硅中的消融率可以达到每个脉冲的高达1μm的水平,具有这种新方法,展示了显着的效率。虽然对于CAF_2观察到的消融率保持在每次脉冲50nm,但到达100μm的深微结构展示了出色的质量,而没有掩模在面罩外部的严重开裂或应力迹象。该技术通过使用常规UV激光允许基于氧化物和氟化物的高质量微型制造生物医疗,电子和光电装置。

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