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Short and Ultrashort Laser Pulses: An upcoming Tool for Processing Optical and Semiconductor Materials

机译:短和超短型激光脉冲:用于处理光学和半导体材料的即将到来的工具

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Laser beam sources emitting pulses with durations in the regime between nano- and femtoseconds are winning more and more importance for processing optical and semiconductor materials. Beneath lithography, etching and coating, laser technology is necessary to support the production of innovative electronic and optical devices. Finest structures, cuts and drillings can be manufactured in a high variety of materials like silicon, glasses but also in composite materials like polymers. In this paper a survey on a number of laser based processes for microelectronic and optoelectronic manufacturing is presented. With regard to this context effects and material interactions are discussed and attached to different laser beam sources. The quality of processes as well as their economical meaning from perspective of laser technology is evaluated. An overview about machining and actual trends for ns-. upcoming ps- and fs-laser technology are presented.
机译:激光束源在纳米和飞秒之间的制度中发射脉冲的脉冲正在越来越重要地用于处理光学和半导体材料。在光刻,蚀刻和涂层下方,激光技术是支持创新电子和光学器件的生产所必需的。最好的结构,切割和钻孔可以在硅,眼镜等高品种的材料中制造,也可以制造硅,也可以是聚合物等复合材料。本文介绍了关于微电子和光电制造的许多激光基础方法的调查。关于这种上下文的效果和材料相互作用被讨论并连接到不同的激光束源。评估了从激光技术角度的过程质量以及它们的经济含义。关于NS-加工和实际趋势的概述。提出即将推出的PS和FS-激光技术。

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