PRESENTING DIE TO A PICK AND PLACE MACHINE AT 3,000 TO 4,000 UPH WITHIN ACCEPTABLE LOCATION PARAMETERS

摘要

Waffle pack and tape and reel presentation has been the traditional paradigm for the integration of bare die component packages to surface mount pick-and-place machines. When designing a replacement, "tapeless" transport mechanism a variety of factors can interfere with accurate transport and presentation. In order for its new die presentation system to meet the requirements of high-volume, high-speed production applications, the Hover-Davis development team overcame vibration, adhesion, friction, and inertia, as well as orientation and location, in the engineering of a transport mechanism.