^4fThe Newly Developed Flame Retardant XLPO Wire for LCD Back Light

摘要

^7fIn this paper, we present the effects of base polymers on the high temperature cut-through property for LCD back light wire and also show relationships between cut through property and thermal deformation rate and cross-linking density. Higher cross-linking density of insulation material is related to lower heat deformation rate and passing the cut through test. It is revealed that the value of yield strength is an important factor in determining whether or not cut through takes place. The higher the value of yield strength at cut through test temperature, the greater the force required to cause cut-through at that temperature. Lower tan δ leads to lower time dependent deformation at high temperature. Insulation based on ethylene vinyl copolymer and rubber shows not only higher cross-linking density but also lower tan δ (low viscous properties) than the insulation based on poly-ethylene because of high efficiency of radiation cross-linking and also shows lower. The modified heat deformation test method could be used for predicting the high voltage cut through test result without testing final wire products.