ADVANCES IN LTCC COMPONENTS FOR RF AND MICROWAVE FREQUENCIES

摘要

Low Temperature Co-fired Ceramic (LTCC) offers unparalleled advantages of smaller size, lower cost and higher reliability than conventional hybrid microcircuits and assemblies. At the same time its lower NRE and lead times make it attractive to moderate and high volume markets. Traditional lead attachment to LTCC via brazing is an expensive process which takes away one of the advantages. A proprietary welding process (1) has been developed which allows lead attachment to LTCC at a lower cost, and is flexible enough to be used at any stage of manufacturing.