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Semiconductors power layout: new challenges for the optimization of high power converter

机译:半导体和电源布局:高功率转换器优化的新挑战

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The design of a high power converter has to take into account thermal and EMC aspects. These ones are governed by both semiconductors and cabling imperfections. This paper illustrates the effects of these two main actors on two different aspects: paralleling components and switching performances, which includes overvoltage, losses and EMI sources.
机译:高功率转换器的设计必须考虑热量和EMC方面。这些由半导体和布线缺陷管辖。本文说明了这两个主要参与者对两个不同方面的影响:并联组件和切换性能,包括过电压,损耗和EMI源。

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