System-on-Package (SOP) architectures for compact and low cost RF front-end modules

摘要

This paper presents the development of advanced System-on-Package (SOP) architectures for compact and low cost wireless RF systems. We present the design of compact stacked patch antennas using SHS structures for LMDS and V-band applications. Multi-layer organic packaging development for SOP is reported. An Intelligent Network Communicator (INC) RF block is presented as example of the high performances of multi-layer organic package. A novel ultra-compact 3D integration technology for SOP-based solutions is proposed and utilized for the implementation of a Ku band VCO module. In addition, the fabrication of very high Q-factor inductors in Liquid Crystal Polymer multi-layer substrate demonstrate superior performances compared to any other multilayer organic packages.