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Diagnostics of N_(2) and O_(2) dissociation in RF plasmas by vacuum ultraviolet emission and absorption spectroscopy

机译:通过真空紫外线发射和吸收光谱诊断RF等离子体中的N_(2)和O_(2)解离

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N_(2) plasmas are a useful source of N atoms and have been applied to the formation of a high-quality, thin oxynitride film which prevents boron from penetrating through a gate oxide film, and also to the growth of III-V semiconductor nitride films by plasma-assisted, molecular-beam epitaxy. O_(2) plasmas have also been widely used in microelectronics fabrication processes such as photoresist ashing. The next probable application of O_(2) plasma is the low-temperature, high-growth-rate formation of gate oxides for thin film transistors that is achievable using highly Kr-diluted O_(2) plasmas. In the above applications, the knowledge of N_(2) and O_(2) dissociation degree is indispensable for process improvement and optimization. In this presentation, we focus on the diagnostics of N_(2) and O_(2) dissociation in N_(2) and rare-gas-diluted O_(2) low-pressure plasmas. As for N_(2) plasmas, a novel, simple procedure by vacuum ultraviolet (VUV) optical emission spectroscopy is applied to evaluation of N_(2) dissociation degree in an N_(2), inductively coupled RF (13.56 MHz) plasma. This procedure is based on actinometry and determines a ratio of N atom number density against N_(2) by comparing N-atom optical emission line intensity at 174.4 nm with the N_(2) second-positive (0,0) band intensity. Depending on the RF power (0.3-1 kW) and N_(2) pressure (0.133-1.33 Pa) chosen for plasma generation, N_(2) dissociation degree is found to range from 0.006 to 0.044. These results are comparable with those reported previously (0.01-0.049) by others, confirming the physically reasonable evaluation of N_(2) dissociation degree by the present procedure. The contribution of stepwise excitation out of N_(2) (A~(3)(SIGMA)_(u))~(+) (N_(2) (A)) metastables to the N_(2) 2nd positive emission, which may cause a large error of N_(2) dissociation evaluation, is found to be negligible from the net excitation rate computed using an assumed cross section of the electron impact excitation from N_(2) (A) to the N_(2) C ~(3)(PI)_(u) state and the N_(2) (A) number density deduced from a simple kinetic model. Using the present procedure, N_(2) dissociation degree is evaluated within a possible error of 27 percent if the electron temperature in N_(2) plasmas is in a range of 3-6 eV. In addition, N_(2) dissociation degree is obtained without the knowledge of N and N_(2) translational temperatures, even when these species are not in thermal equilibrium. These features are the advantages of the N_(2) dissociation evaluation by VUV emission spectroscopy to that by VUV absorption spectroscopy.
机译:N_(2)等离子体是N原子的有用来源,已被应用于形成高质量的薄氧膜,其防止硼通过栅极氧化膜,以及III-V半导体氮化物的生长通过等离子体辅助,分子束外延薄膜。 O_(2)等离子体也已广泛用于微电子制造工艺,例如光致抗蚀剂灰化。 O_(2)等离子体的下一个可能应用是用于薄膜晶体管的栅极氧化物的低温,高生长速率形成,其使用高kr稀释的O_(2)等离子体可实现。在上述应用中,N_(2)和O_(2)解离程度的知识对于过程改进和优化是必不可少的。在本介绍中,我们专注于N_(2)和O_(2)解离在N_(2)和稀释气体稀释的O_(2)低压等离子体中的诊断。对于N_(2)等离子体,一种新颖的,通过真空紫外线(VUV)光发射光谱的新颖,施加到N_(2),电感耦合的RF(13.56MHz)等离子体中的N_(2)解离程度的评价。该过程基于静脉测量法,通过将N-Atom光发射线强度与N_(2)第二正(0,0)频带强度进行比较,通过将N-Atom光发射线强度进行比较来确定N原子数密度与N_(2)的比率。根据RF功率(0.3-1kW)和N_(2)压力(0.133-1.33Pa)选择等离子体产生,发现N_(2)解离程度为0.006至0.044。这些结果与他人以前报告的那些(0.01-0.049)相当,通过本程序确认N_(2)解离程度的身体上合理评价。 n_(2)(a〜(3)(sigma)_(u))〜(+)(n_(2)(a))的贡献,到n_(2)2 nd阳性发射可能导致N_(2)解离评估的大误差,从使用来自N_(2)(a)的电子碰撞激发的假定横截面到N_(2)C〜的净激励率可忽略不计。 (3)(PI)_(U)状态和N_(2)(a)从简单的动力学模型推导的数量密度。使用本方法,如果N_(2)等离子体中的电子温度在3-6eV的范围内,则在27%的可能误差内评估N_(2)解离程度。此外,即使这些物种不在热平衡中,也可以获得没有N和N_(2)平滑温度的N_(2)解离程度。这些特征是N_(2)通过VuV吸收光谱对VuV吸收光谱进行解离评价的优点。

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