Effect of Tape Liftoff Tool Settings and Plasma Conditions on Metal Peeling from Polyimide Surfaces

摘要

In this paper we report the effect of peeling angle and roller pressure on metal damage during tape liftoff process. Using automated inspection, we find that proper peeling angle is required to significantly reduce metal damage. DOE data also shows that an optimized roller pressure is crucial for a damage free process. In addition, this paper also reports the role oxygen plasma can play to improve metal adhesion to the polyimide surfaces. This weak adhesion has been studied extensively in many fields including the semiconductor industry. Our data shows that oxygen plasma can modify the polyimide surface and improve metal adhesion to such a degree that results from tape liftoff are comparable to the solvent liftoff process. The mechanism of adhesion enhancement is also proposed in this paper.