MECHANICAL AND THERMAL PROPERTIES OF EPOXY-INORGANIC FILLER SYSTEM - EFFECT OF FAR INFRARED CURING

摘要

In addition to the difficulties in PCB industry for the past 10 years, the severe competition and sourcing problem of raw material is getting serious. It has resulted in serious contradiction to meet the needs of benefit-creation and high-end technology at a same time. Such problem is not restricted to a certain business field. So, it is necessary to approach simultaneously to the increase of benefit creation and satisfaction the future needs on technological roadmap based on the combination of new technology, new process and new material innovation. Furthermore, those challenges should be performed timely without any delay.