Passive Heat Dissipation Devices for High Power LEDs

摘要

We proposed three solutions to manage the heat dissipation of high power LED. The low junction temperature is maintained no matter from the horizontal heat spreading effect (high thermal conductivity material, flat heat pipe and in-plane micro TE cooler) or temperature gradient generated vertically (conventional heat pipe and cross-plane micro TE cooler), a proper heat sink is still needed to keep a low system thermal resistance.