Semiconductor chip heat fluxes are again rising rapidly and threatening to overwhelm available thermal management techniques. The use of direct pool boiling heat transfer from the chips to dielectric liquids is a primary future alternative, but is limited by the relatively low pool boiling CHF of most candidate liquids. This paper summarizes the progress made during the past two decades towards a refined understanding and improved predictive accuracy of the baseline pool boiling critical heat flux of dielectric coolants and discusses, as well, opportunities for and progress towards passive enhancement of this key boiling metric.
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