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Measurement of Indentation Fracture Toughness of Silicon Nitride Ceramics: II, Effect of the Experimental Conditions

机译:测量氮化硅陶瓷的压痕断裂韧性:II,实验条件的影响

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The influence of two measuring conditions, the elapsed time after indentation and the condition of edge of an indenter, on the indentation fracture toughness of silicon nitrides was assessed. No slow crack-growth after unloading was confirmed by optical microscopic observation of a crack tip induced by the indentation, which led to the negligible difference in fracture toughness measured at 1 and 30 min after the indentation. Measurements with relatively new and used indenters gave almost the same fracture toughness data, indicating that the crack lengths were hardly affected by the slight damage of the corner of the indenter. It was suggested that the large scattering of the indentation fracture toughness reported by the round-robin tests such as VAMAS was not originated from these factors.
机译:评估了两个测量条件,压痕后经过的时间和压痕的边缘条件的影响,对氮化硅的压痕断裂韧性进行评估。通过光学显微镜观察由压痕引起的裂纹尖端的光学显微镜观察卸载后,没有缓慢的裂纹生长,这导致在压痕后1和30分钟测量的断裂韧性的可忽略差异。具有相对较新的和使用的压痕的测量几乎具有相同的裂缝韧性数据,表明裂缝长度几乎不会受到压头角损伤的影响。有人建议,循环试验如vamas的痕量骨折韧性的大散射尚未来自这些因素。

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