Development of a Surface-Mounting High Frequency Relay with Tri-plate Strip line Structure

摘要

In this paper, the techniques and the structure of a high frequency relay which exhibit excellent characteristics in equipment over 2GHz newly demanded for broadband communications are presented. Studies on the relay as a surface-mounting relay which can be efficiently connected to a high-frequency circuit pattern arranged on a printed circuit board (PCB) are also presented. In developing the relay, a tri-plate stripline structure is newly adopted to aim at satisfying both high frequency characteristics and surface mounting specifications. This structure is constructed to have higher performance while succeeding the flatness of the precedent micro strip line structure. By adding a thin GND plate to control the coupling between the inside and outside of the relay in the region of high frequency signals, the isolation characteristics of the relay have been greatly improved.