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Field emission study of Ti-silicide array

机译:Ti-硅化物阵列的现场排放研究

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The Si FEA(field emitter array) was fabricated on the n-type, low resistance (5 ohm-cm) Si(100) wafer through anisotropic etching with dipping in 40 wt.% KOH solution[1]. To increase the thermo-chemical durability of tip, long term stability, and current density, Ti(300nm) film was deposited with electron beam evaporation and the silicide was formed by annealing at 650°[2]. The C54-TiSi2 phase of the sample was formed using XRD analysis. The emission characteristics of the Ti-silicide FEA were compared with those of Si FEA under high vacuum condition of about 10-7Torr. The turn-on voltage of Ti-silicide FEA is about 1500 V. On the other hand, the turn-on voltage of Si FEA is found to be 1,950 V. In addition, the emission stability of the Ti-silicide FEA showed much better than that of Si FEA.
机译:通过浸入40重量%KOH溶液中的各向异性蚀刻,在N型,低电阻(5欧姆-CM)Si(100)晶片上制造Si FEA(现场发射器阵列)。%KOH溶液[1]。为了提高尖端的热化学耐久性,长期稳定性和电流密度,通过电子束蒸发沉积Ti(300nm)膜,通过在650°(2)下通过退火形成硅化物。使用XRD分析形成样品的C54-TISI2相。将Ti-硅化物FEA的排放特性与Si FEA的发射特性与约10-7滴度的高真空条件进行比较。 Ti-硅化物FEA的导通电压约为1500V。另一方面,Si FEA的导通电压是1,950 V.此外,Ti-硅化物FEA的排放稳定性显示得更好比Si Fea。

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