Low temperature thermoelectric modules

摘要

Optimization of modules based on the new low temperature thermoelectric material CsBi{sub}4Te{sub}6 has been investigated. These materials have shown very promising thermoelectric properties for cooling applications in the 100-300K range, however doping and alloying optimization is essential toward developing high efficiency coolers. Progress in device fabrication through the investigation of contact resistances for various electrodes is reported.