A new approach to linear connections building BIST structure based on CSTP structure

摘要

The paper presents a method to build testing structure of single- and multi-modular circuits. The presented method is based on creation of linear connections which build the testing structure of a circuit equipped with CSTP structure, composed of boundary scan path elements. The results of investigations testify efficiency of the method. The discussion on influence of different modifications of CSTP structure on work efficiency was made. The method discussed in the paper can become an alternative to the method which separates internal self-testing paths.