Location and shape identification of material flaw using high Tc-SQUID

摘要

This paper is concerned with a regularized parameter estimation problem for detecting and characterizing a defect in conductors. A nondestructive evaluation technique is described with the use of high critical temperature superconducting quantum interference devices. The mathematical description of the nondestructive testing is governed by an electrical potential problem in a three dimensional spatial domain. The identification problem treated here is discussed within the theoretical framework of a regularized parameter estimation technique. A method for adjusting the optimal regularization parameter is effectively used in computational experiments.