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Performance improvements in arrayed waveguide-grating modules

机译:阵列波导光栅模块的性能改进

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The future of telecom system design relies heavily on combining many optical devices into multifunctional modules with superior performance, lower cost, and smaller overall package size. The AWG module developments discussed here will afford comprehensive benefits to advanced optical networks. Current AWG development efforts focus on lowering insertion loss, reducing crosstalk, increasing channel bandwidth, decreasing channel spacing, managing dispersion, decreasing package size, and incorporating intelligent electronics. Better matching of the waveguide geometry and index of the integrated circuit to the optical fiber reduces the coupling loss. Other design optimizations to the waveguide bend radius and waveguide pitch at the slab can decrease circuit loss. High quality processing reduces the inhomogenieties that cause phase errors in AWGs and thus increase channel crosstalk. Optical design modifications in AWG waveguide tapers at the slab can change the passband shape and increase the channel bandwidth. Dispersion can be managed by better controlling the dispersion slope allowing for compensation. Innovations for temperature control circuitry and novel packaging designs and materials allow for smaller modules and reduced power consumption.
机译:电信系统设计的未来严重依赖于将许多光学器件组合成具有卓越性能,更低的成本和更小的整体包装尺寸的多功能模块。这里讨论的AWG模块开发将为高级光网络提供全面的益处。目前的AWG开发努力专注于降低插入损耗,减少串扰,增加信道带宽,降低通道间距,管理分散,减少封装尺寸,并结合智能电子。更好地匹配光纤几何形状和集成电路的索引到光纤降低了耦合损耗。在板坯处的波导弯曲半径和波导间距的其他设计优化可以降低电路损耗。高质量处理减少了在AWG中引起相位误差并因此增加了渠道串扰的非原因。板坯处的AWG波导锥度的光学设计修改可以改变通带形状并增加通道带宽。可以通过更好地控制允许补偿的色散斜率来管理分散。温度控制电路和新型包装设计和材料的创新允许更小的模块和降低的功耗。

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