Non-destructive analysis on flip chip package with TDR (time domain reflectometry) and SQUID (superconducting quantum interference device)

摘要

With increasing applications on thin multi-layers flip chip packages with complex interweaving layout, the difficulties and ineffectiveness on fault isolation with currently nondestructive techniques such as RTX (Real Time X-ray) and SAM (Scanning Acoustic Microscope) have increased significantly. TDR (Time Domain Reflectometry) and the scanning SQUID (Superconducting Quantum Interference Device) as the new nondestructive techniques on fault isolation have been developed to overcome some of the difficulties. In this paper, the methodology and application of TDR and SQUID on open and short failure isolations in flip chip packages have been presented. The analysis procedure and results on both of fault isolations as well physical analyses to further inspection the root cause have also been discussed in detail.