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Reduction of transient thermal deformation in a thin plate under moving heat load using thermal modal analysis based control methods

机译:基于热模拟分析的控制方法,在移动热负荷下减少薄板中的瞬态热变形

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Thermal errors are important sources of positioning errors in precision machines [1] and are more and more becoming determining factors to meet increasing specifications. In this paper, thermal modal analysis is used to study the behaviour of an industrial inkjet printer under thermal load and to develop a reduced order thermal error model while maintaining the precision. The reduction of transient thermal deformation by adding extra heat loads is analysed as a possible method to improve thermal behaviour of high precision printing systems. Two approaches are taken and their simulation results are compared.
机译:热误差是精密机器中定位误差的重要来源[1],并且越来越多地确定满足越来越多的规格的因素。在本文中,使用热模态分析来研究热负荷下工业喷墨打印机的行为,并在保持精度的同时开发减少的阶热误差模型。通过增加额外的热负荷来减少瞬态热变形作为提高高精度印刷系统的热行为的可能方法。采取了两种方法,并比较了它们的仿真结果。

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