A study of flat plate heat pipe (modeling and verification by way of experiment)

摘要

With evolution of personal computers, chip performance and heat dissipation rate have been increasing. Inevitably, thermal design for the personal computers has become more important. An flat plate heat pipe technology is very promising as a thermal management device in electronic equipment such as notebook computers. In this study, working model of the flat plate heat pipe was structured, considering the capillary limit. Furthermore, the experimental evaluation were carried out and these results were in good agreement with the predicted results using this model.