Cooling performance of very compact heat sinks (comparison of cross-flow cooling and jet cooling)

摘要

High-performance compact heat sinks have been developed for effective cooling of high-density LSI packages. Heat transfer and pressure loss characteristics of the heat sinks in both air-cross-flow and air-jet cooling have been experimentally studied. The present heat sinks were of plate-fin arrays with a fin pitch of 0.7mm. The thermal conductance in cross-flow cooling was 20-40 % larger than that in jet cooling. The correlation of Colburn j-factor/Fanning friction factor vs. the Reynolds number for the present heat sinks was found to have similar tendency with that of a conventional large-size heat exchanger.