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Application of CLD for reduction of structure-borne noise in electronic enclosures

机译:CLD在电子外壳中降低结构噪声的应用

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Large clusters of electronic equipment inside enclosures could generate structural vibrations and radiated noise. Depending on the location of an electronic enclosure, the internally generated vibrations and noise may be transmitted to the outside environment and create secondary problems. A customized constrained layer damper (CLD) solution was investigated for reducing structural vibrations and structure-borne noise. The elastomeric element of the CLD is based on a modified formula suitable for room temperature applications. A metal plate was used to represent an electronic enclosure wall. Vibrating metal plates with and without the application of CLD are evaluated. It is demonstrated that the metal plate with CLD showed 8 - 25 dB reduction of noise in the frequency range of 60 Hz to 1000 Hz. Results from the CLD tests are presented along with further considerations of CLD for application to electronic enclosures.
机译:内部内部的大型电子设备集群可以产生结构振动和辐射噪声。 根据电子机箱的位置,可以将内部产生的振动和噪声传输到外部环境并产生二次问题。 研究了一种定制的约束层阻尼器(CLD)解决方案,以减少结构振动和结构传承噪声。 CLD的弹性元素基于适用于室温应用的改性公式。 使用金属板代表电子外壳壁。 评价具有和不应用CLD的振动金属板。 结果证明,具有CLD的金属板在60Hz至1000Hz的频率范围内显示8-25dB的噪声降低。 来自CLD测试的结果以及CLD用于应用于电子外壳的进一步考虑。

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