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New silicon-based ferroelectric sandwich structure

机译:基于新的硅铁电三明治结构

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A new silicon-based PbTiO/sub 3//Pb(Zr,Ti)O/sub 3//PbTiO/sub 3/ (PT/PZT/PT) sandwich structure is prepared using a sol-gel method. The annealing temperature is greatly reduced compared with that without PT layers. Capacitance-voltage (C-V), current density - electric field (J-E), polarization-field (P-E) and dielectric-frequency responses of the sandwich structure are studied. The maximum dielectric constant of about 900 is obtained at the coercive field 18 kV/cm, and the remnant polarization is 16 /spl mu/C/cm/sup 2/. The current density is 5 /spl times/ 10/sup -9/ A/cm/sup 2/ below 200 KV/cm. The dielectric constant of the structure stays constant at low frequency, and decreases to some degree at high frequency. The PZT films are proved to have very good dielectric and ferroelectric properties. The PT/PZT/PT sandwich structure will have a use in memory devices and other applications.
机译:使用溶胶方法制备新的新型基于硅基PBTIO / SUB 3 // PB(Zr,Ti)O / Sub 3 / Sub 3 /(Pt / Pt / Pt)夹层结构。与没有PT层的情况相比,退火温度大大降低。研究了电容 - 电压(C-V),电流密度 - 电场(J-E),偏振场(P-E)和夹层结构的介电频率响应。在矫顽磁场18kV / cm处获得约900的最大介电常数,并且残余极化是16 / SPL mu / c / cm / sup 2 /。电流密度为5 / spl时间/ 10 / sup -9 / a / cm / sup 2 /低于200kV / cm。结构的介电常数以低频保持恒定,并且在高频下降低到某种程度。证明PZT薄膜具有非常好的电介质和铁电性能。 PT / PZT / PT夹层结构将在存储器设备和其他应用中使用。

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