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Effect of Inter-Layer Pressure on Dielectric Breakdown Characteristics of Metallized Polymer Films for Capacitor Applications

机译:层间压力对电容器应用金属化聚合物膜介电击穿特性的影响

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Relatively high level of inter-layer pressure is often promoted for wound metallized film capacitors as it has been found to reduce the capacitance loss during self-healing breakdown. However, the effect of inter-layer pressure on the dielectric breakdown strength of metallized polymer films is not well documented and further analysis is needed. In this study, the effect of inter-layer pressure on the dielectric breakdown characteristics of various metallized polymer films is studied. By utilizing low-energy self-healing breakdown, multiple breakdowns can be measured per sample film. The results suggest that high inter-layer pressure has a negative impact on the breakdown characteristics of the metallized films studied and, in the worst case, may lead to insulation resistance failure.
机译:对于卷绕金属化薄膜电容器,通常促进相对较高的层间压力,因为已经发现在自愈合击穿期间降低电容损耗。然而,层间压力对金属化聚合物膜的介电击穿强度的影响并不清楚地记录并进一步分析。在该研究中,研究了层间压力对各种金属化聚合物膜的介电击穿特性的影响。通过利用低能量自愈合击穿,可以每种样品膜测量多次击穿。结果表明,高层间压力对所研究的金属化薄膜的击穿特性产生负面影响,并且在最坏的情况下,可能导致绝缘性耐受性。

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