Existing optical fibre and fibre-device fabrication techniques have been complemented recently by the development of new processes for the fabrication of planar optical waveguides and devices. These processes rely on new forms of plasma reactors and diagnostic systems which allow in-situ control of optical parameters such as refractive index. Recent technical developments in the micro-electronics industry now allow the fabrication of very compact and highly complex optical circuitry which can be produced on a single photonic chip. they also offer the potential to integrate photonic devices with semiconductor sources and detectors to realise a compact, hybrid photonic-optoelectronic chip, complete with fibre pig-tailing, Because of their compactness and potential low cost, these types of photonic chips are attractive components for future high-capacity optical telecommunications and other networks now being planned. This paper presents the general techniques used in the plasma processing of thin films of silicate glasses including Plasma Enhanced Chemical Vapour Deposition (PECVD) and Reactive Ion Etching (RIE).
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