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'Super Thin Advanced Tin~TM Coating Technology for Reduced Insertion Forces'

机译:“超薄先进的锡〜TM涂层技术,减少插入力”

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摘要

Increasing pin counts for multiple termination in both automotive and electronic interconnects continue to drive the need for reduced insertion forces. Design engineers are looking for material systems that will provide acceptable electrical performance / solderability generally achieved by using thicker tin coatings and simultaneously reduce insertion forces generally achieved by thinner tin coatings. In this paper we will present data that evaluates commercially available tin coatings, both hot dipped and electro-tinned, and compares performance of these coatings with a new Super Thin Advanced Tin~TM Coating Technology. Analysis will be in terms of electrical performance, solderability shelf life, and insertion forces. Data generated on coupon samples to predict performance will be provided alogn with results of performance seen in actual connectors.
机译:在汽车和电子互连中增加多个终端的销钉数继续推动减少插入力的需要。设计工程师正在寻找通过使用较厚的锡涂层而提供通常实现的可接受的电性能/可焊剂的材料系统,并同时减少通过较薄的锡涂层实现的插入力。在本文中,我们将呈现评估市售的锡涂层的数据,热浸和电镀,并通过新的超薄先进的TIN〜TM涂层技术进行比较这些涂层的性能。分析将在电性能,可焊性保质期和插入力方面。在优惠券样本上生成的数据,以预测性能,并在实际连接器中看到的性能结果提供了Alogn。

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