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Mechanical calibration of MEMS spring with 0.1-#x03BC;n force resolution

机译:MEMS弹簧的机械校准,具有0.1μN力分辨率

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The direct calibration of MEMS springs made of single crystal silicon was carried out using a mechanical force measurement tool. The spring device for calibration fabricated from silicon on insulator (SOI) wafer contains four folded-beam springs. The spring constants of different-length devices were directly measured using electromagnetic force-feedback balance, whose force resolution was about 0.2 μN. The spring constants of the two types of folded-beam springs, whose designed constant was 0.3 and 0.7 N/m, were 0.18 and 0.57 N/m, respectively. The spring constants were successfully calibrated, which shows that this tool can calibrate various kinds of MEMS flexible structures.
机译:使用机械力测量工具进行由单晶硅制成的MEMS弹簧的直接校准。用于由绝缘体上的硅(SOI)晶片制造的校准弹簧装置包含四个折叠梁弹簧。使用电磁力反馈平衡直接测量不同长度器件的弹簧常数,其力分辨率为约0.2μN。两种类型的折叠梁弹簧的弹簧常数,其设计常数为0.3和0.7n / m,分别为0.18和0.57n / m。 Spring常数已成功校准,这表明该工具可以校准各种MEMS柔性结构。

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