ENERGY DISSIPATION AND CRACK PROPAGATION IN VISCOELASTIC ADHESIVES

摘要

By simultaneously measuring the displacement, load, and contact area between a hemispherical indenter and an adhesive layer during a prescribed deformation history, we are able to measure the detailed mechanical properties of a thin adhesive layer. A fracture mechanics model has been developed that allows us to determine the energetic driving force for crack propagation from the stored elastic energy within the adhesive.