A new low cost, laminate based CSP technology has been develoepd for RF mobile phone applications. The key feature required for this type of package is the ability to provide low inductance to ground. In order to meet this design requirement, land grid array solder joints and a center ground pad are required. Due to the size and stand off of the solder joints there is a concern of both solder joint reliability due to creep strain and mechanical failure of the solder pad due to mechanical shock occurring when the phone is accidentally dropped. A series of experiments and numerical analyssi are conducted to measure the thermal performance and verify both package and board level reliability.
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