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Fracture Behavior of Single-Crystal Silicon Microelements and Nanoscopic AFM Damage Evaluation

机译:单晶硅微量元素和纳米镜伤害评价的裂缝行为

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Simple bending tests of single-crystal silicon microelements fabricated by photoetching were performed. Silicon microelements deformed elastically until final catastrophic failure, showing a brittle nature. The fracture strength increased with a decrease in specimen size, and the maximum strength reached about 8 GPa. However, the Si microelements were sensitive to notch, and nanometer-deep notch caused a decrease in the fracture strength. In laboratory air, no fatigue damage was observed even though the surface was nanoscopically examined by an atomic force microscope (AFM). However, the fatigue lives in water were decreased compared with that in air. Crack formation in {111} plane was promoted by a synergistic effect of dynamic loading and water environment. An AFM was capable of imaging nanoscopic cracks, which caused failure in water.
机译:进行了通过光刻制造的单晶硅微单的简单弯曲试验。硅片微重织弹性变形,直至最终灾难性失败,显示出脆性性质。断裂强度随着样品尺寸的降低而增加,最大强度达到约8GPa。然而,Si微量元素对凹口敏感,纳米深度凹口导致断裂强度的降低。在实验室空气中,即使通过原子力显微镜(AFM)纳米镜检查,也不会观察到疲劳损伤。然而,与空气中的水相比,疲劳寿命减少。 {111}平面中的裂缝形成是通过动态载荷和水环境的协同效应来推广。 AFM能够成像纳米镜裂缝,这导致水中的失效。

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