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Model describing grain size evolution of selected copped alloys during and after deformation

机译:描述在变形期间和之后所选COPPHED合金的晶粒大小演化的模型

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In the paper the mathematical models describing grain size evolution of selected copper alloys caused by dynamic, static and metadynamic recrystallizations as well as grain growth were prersented. Evolution of grain size caused by dynamic and metadynamic recrystallization is function of Zener-Hollomon parameter, constant parameter A in Garafalo equation and two material constants. Evolution of grain size caused by static recrystallization is function of Zener-Hollomon parameter, initial grain size, degree of deformation and three material constants. Grain growth is described by activation energy of steady-state flow, temperature, time, grain size at the beginning of grain growth process and two material constants. All parameters describing grain size evolution were determined by using torsion test and structural investigation.
机译:在纸质中,术后描述了描述由动态,静态和新动力学重结晶和晶粒生长引起的所选铜合金的晶粒尺寸演化的数学模型。动态和Metadynamic重结晶引起的晶粒尺寸的演变是ZENER-HOLLOMON参数,GARAFALO方程中的恒定参数A和两种材料常数的作用。静电再结晶引起的晶粒尺寸的演变是齐纳 - 霍梅伦参数,初始粒度,变形程度和三种材料常数的作用。通过牙颗粒生长过程开始时的稳态流动,温度,时间,晶粒尺寸和两种材料常数的激活能量来描述晶粒生长。通过使用扭转测试和结构调查来确定描述晶粒尺寸进化的所有参数。

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