FINITE ELEMENT SIMULATION OF MICROSTRESSES IN ALUMINIUM INTERCONNECTS

摘要

A 3D finite element model was developed in which the near-bamboo microstructure of the Al-lines is taken into account, i.e. grains are columnar and the grain size is larger than the line width. The Al-lines exhibit a strong (111) fibre texture, with the fibre axis perpendicular to the substrate. The microtexture of the interconnect is determined using Orientation Imaging Microscopy. The individual grain orientations are then introduced in an elastic-plastic finite element model developed by Kalidindi et al. (1). For each grain the appropriate elasticity tensor is calculated. This allows to obtain detailed information on the correlation between individual grain orientation and thermal stresses.