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Power supply arcing

机译:电源电弧弧线

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The trend to pack more power in smaller spaces is leading to higher rates of computer power supply arcing in the field. Power density increase is being achieved by decreasing the spacing between features such as the power train MOSFET leads and by increasing the switching frequency. Both these changes make power supplies more prone to field arcing. This paper discloses a technique called the partial vacuum test to predict the arcing propensity in power supplies. The partial vacuum test also helps determine the corrective actions, needed to avoid field arcing, by indicating the locations susceptible to arcing. The paper also describes a test called the zinc spray test that can help determine the minimum spacing between features, subjected to high voltages with high frequency harmonics, that will not arc in the field.
机译:在较小空间中打包更多功率的趋势导致该领域的计算机电源电弧速度提高。通过降低诸如电力系MOSFET引线的特征之间的间隔和通过增加开关频率来实现功率密度增加。这两种变化都使电源更容易发生现场电弧。本文公开了一种称为部分真空测试的技术,以预测电源中的电弧倾斜。部分真空测试还通过表示易受电弧的位置来帮助确定所需的纠正措施。本文还描述了一种称为锌喷雾试验的测试,可以帮助确定具有高频谐波的高电压之间的特征之间的最小间隔,这不会在该领域弧。

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