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AUTOMATED TAPE PLACEMENT WITH IN-SITU ELECTRON BEAM CURE

机译:使用原位电子束固化自动胶带展示位置

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Automated Tape Placement (ATP) is widely used in the aerospace industry to produce large composite structures with complex geometry. An innovative process combining ATP with in-situ electron beam (EB) curing has the potential to decrease composite part costs, especially for large integrated structures. A group consisting of Science Research Laboratory, Applied Poleramics and Northrop-Grumman is currently developing resins, tape and electron gun technology for in-situ curing of ATP composites [1]. This paper presents mechanical and thermal properties for composite panels fabricated using a simulated in-situ EB cure process, with comparison to panels cured in a single step EB process. We also present design tradeoffs for in-situ EB curing systems and describe how the choice of processing geometry affects the design. SRL is fabricating an in-situ EB curing system based on these designs. The portable robotic EB gun will be combined with an existing ATP head for demonstration of the in-situ curing process next year.
机译:自动胶带放置(ATP)广泛用于航空航天工业,以生产具有复杂几何形状的大型复合结构。将ATP与原位电子束(EB)固化相结合的创新过程具有可降低复合部件成本的可能性,特别是对于大型集成结构。一组由科学研究实验室,应用的Poleramics和Northrop-Grumman组成目前正在开发树脂,胶带和电子枪技术,用于ATP复合材料的原位固化[1]。本文介绍了使用模拟的原位EB固化工艺制造的复合板的机械和热性能,与在单步EB过程中固化的面板进行比较。我们还为原位EB固化系统提供了设计权衡,并描述了处理几何形状的选择如何影响设计。 SRL基于这些设计制造原位EB固化系统。便携式机器人EB枪将与现有的ATP负责人相结合,以便在明年的原位固化过程中进行示范。

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