Clean Dicing of Compound Semiconductors Using the Water-Jet Guided Laser Technology

机译：使用喷射引导激光技术清洁化合物半导体的切割

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摘要

The water-jet-guided laser is a new technology for micro machining that combines a laser beam into a hair-thin, low-pressure water jet for wafer dicing. In addition to silicon, it can dice compound semiconductors such as GaAs, InP and SiC without damage.

机译：喷气式引导激光器是微加工的新技术，它将激光束与晶片切割的毛发薄的低压水射流相结合。除了硅外，还可以骰子化合物半导体，例如GaAs，INP和SiC而不会损坏。

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来源
《IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop》|2006年||共4页
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Delphine Perrottet; Sean Green; Bernold Richerzhagen;
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原文格式 PDF
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中图分类 TN305-53;
关键词
Laser dicing; Water jet-guided laser; Laser-Microjet; Compound semiconductors; Wafer edge grinding;

机译：激光切割;水喷射引导激光;激光微射精;复合半导体;晶圆边缘研磨;

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专利

1. Water-Jet Guided Laser Cutting Technology- an Overview [J] . Vitus M. Tabie, Majeed 0. Koranteng, Adams Yunus, Lasers in Manufacturing and Materials Processing . 2019,第2期

机译：水射流引导激光切割技术-概述
2. Water-Jet Guided Laser Cutting Technology- an Overview [J] . Vitus M. Tabie, Majeed 0. Koranteng, Adams Yunus, Lasers in Manufacturing and Materials Processing . 2019,第2期

机译：水射流引导激光切割技术 - 概述
3. Waterjet-guided laser addresses particle generation in semiconductor dicing [J] . DELPHINE PERROTTET, AKOS SPIEGEL, FRANK WAGNER, CleanRooms . 2004,第10期

机译：水刀引导的激光解决了半导体划片中的颗粒生成问题
4. Clean Dicing of Compound Semiconductors Using the Water-Jet Guided Laser Technology [C] . Perrottet, D., Green, . 2006

机译：使用水射流引导激光技术对化合物半导体进行清洁切割
5. TOPICS IN GUIDED-WAVE OPTICS: SINGLE-WAVELENGTH ETCHED-COUPLED-CAVITY INDIUM-GALLIUM - ARSENIDE PHOSPHORUS/INDIUM PHOSPHORUS SEMICONDUCTOR LASERS EMITTING AT 1.3 MICRONS, HIGH POWER SEMICONDUCTOR LASER ARRAYS AND CROSS-TALK PROBLEMS IN OPTICAL DIRECTIONAL COUPLERS. [D] . CHEN, KUO-LIANG. 1985

机译：导波光学中的主题：单波长蚀刻耦合腔铟镓-砷磷/铟磷半导体激光器的发射功率为1.3微米，大功率半导体激光阵列的发射率和入射角为三角形。
6. Technology Roadmaps for Compound Semiconductors [O] . Herbert S. Bennett 2000

机译：复合半导体技术路线图
7. Comparative Study of Remote Fiber Laser and Water-Jet Guided Laser Cutting of Thin Metal Sheets [O] . Hock Klaus, Adelmann Benedikt, Hellmann Ralf 2012

机译：薄板金属薄板的远程光纤激光和水射流引导激光切割的比较研究
8. Millimeter-Wave Applications of Semiconductor Dielectric Waveguides with Plasma Layers (Surface or Buried) Generated from Semiconductor Lasers. [R] . Butler, J. K. 1992

机译：具有由半导体激光器产生的等离子体层（表面或掩埋）的半导体介电波导的毫米波应用。

Clean Dicing of Compound Semiconductors Using the Water-Jet Guided Laser Technology

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