Electrical performance of buried capacitors in multi-layered PCBs

摘要

This paper describes the design of prototype buried capacitors and presents some measurement and modeling results performed on these test structures. This work is being carried out under a European Brite-EuRAM funded project, COMPRISE. Theobjective of this project is to develop new materials and manufacture processes to embed passive components (R, L, and C) within printed wiring structures fabricated from laminate materials.