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Influence of Substrate Temperature on Microcracks Formation in Plasma-Sprayed Yttria-Stabilized Zirconia Splats

机译:基质温度对等离子体喷涂的氧化钇稳定的氧化锆Splats中微裂纹形成的影响

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YSZ molten droplets created by plasma spraying were deposited on the YSZ substrate preheated to different temperature from 75°C to 1000°C. The results showed that there is little change in crack spacing when substrate temperature is less than about 740°C, and a significant increase in crack spacing from 3.54 μm at 740°C to 10.91 μm at 1000°C was observed. A simple qualitative model was proposed on the basis of the origin of thermal stresses to explain the influence of substrate initial temperature on crack density characterized by crack spacing. The analysis indicates that the results can be ascribed to the changes in tensile stress and splat/substrate adhesion resulting from changes of substrate initial temperature.
机译:通过等离子体喷涂产生的YSZ熔融液滴在预热至不同温度至1000℃的YSZ底物上沉积在YSZ基板上。结果表明,当衬底温度小于约740℃时,裂纹间距几乎没有变化,观察到在740℃至10.91μm的3.54μm的裂缝间距的显着增加。基于热应力的起源,提出了一种简单的定性模型,以解释基材初始温度对具有裂纹间距的裂纹密度的影响。该分析表明,由基板初始温度的变化导致的拉伸应力和Splat /衬底粘附的变化可以归因于抗拉应力和Splat /衬底粘附的变化。

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