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Interest of friction stir processing for the development of graded oxide dispersion strengthened Cu based materials.

机译:摩擦搅拌加工对梯级氧化物分散的兴趣加强Cu基材料。

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The present study aims at elaborating innovative copper based composite plates with a graded microstructure and thereby evolutive mechanical, thermal, electrical and wear properties along their thickness. Early friction stir processing conditions were used to obtain the graded microstructures with decreasing percentages of yttrium oxide (Y_2O_3) from the surface to the interior of the plate. Initially, particles of Y_2O_3 with diameter in the micrometer range are compacted within V-grooves machined on the copper plate surface. The powder particles are then incorporated into the plate by insertion of a rotating tool generating extrusion and forging. Contrary to usual processes (powder metallurgy, ion implantation, surface oxidation or nitriding), friction stir processing takes advantage of the possibility to treat variable depths of material in a few minutes. The sample microstructure and its gradual features are investigated at various scales by optical microscopy for the grain structure and by scanning electron microscopy for the powder distribution. Furthermore, the microhardness profiles are measured at various depths across the graded material. The present paper deals with the correlation between the microstructure of an early sample and its mechanical properties.
机译:本研究旨在详细阐述具有梯度微观结构的创新的铜基复合板,从而沿其厚度的演化机械,热,电气和磨损性能。早期摩擦搅拌加工条件用于获得从表面到板内部的氧化钇(Y_2O_3)百分比的渐变微观结构。最初,带有直径的μm_3的颗粒在铜板表面加工的V形槽内压实。然后通过插入产生挤出和锻造的旋转工具将粉末颗粒掺入板中。与常规方法(粉末冶金,离子注入,表面氧化或氮化)相反,摩擦搅拌加工利用几分钟内处理可变深度的可变深度。通过用于晶粒结构的光学显微镜和通过扫描电子显微镜进行粉末分布,在各种尺度上进行样品微结构及其逐渐特征。此外,微硬度轮廓在分级材料上的各种深度处测量。本文涉及早期样品的微观结构与其机械性能之间的相关性。

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