Packaging aspects of the Jitney parallel optical interconnect

摘要

The Jitney parallel optical interconnect is a prototype 20-channel wide, low cost data link, designed for operation at speeds up to one Gbyte/s over distances approaching 100 meters. The package is based on (1) an inexpensive overmolded leadframe, (2) passive optical alignment, and (3) plastic molded parts. The packaging challenges in the fabrication of the components, their assembly, and in the achievement of the performance goals are described.