In the volume production of Tape Ball Grid Array (T-BGA), prevention of delamination between the polyamide tape and the adhesive film has been a serious challenge to the semiconductor packaging community. Since the delamination usually causes solder ball short during the solder reflow process, it is necessary to clarify the mechanism of the delamination as well as to improve the characteristics of the adhesive film. With a view to secure the stable productivity and reliability of the package, we investigated the three following physical characteristics of the adhesive in an attempt to acquire the optimal adhesive solution: resistance to reflow delamination; thermal fatigue; and longer storage life.
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