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Constant current charge-to-breakdown: Still a valid tool to study the reliability of MOS structures?

机译:恒定电流充电到静置:仍然是研究MOS结构可靠性的有效工具?

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It is shown that the conventional interpretation of constant current Q/sub BD/ to evaluate the influence of process variations on the reliability of MOS structures can lead to erroneous conclusions. For a fixed thickness, the comparison of Q/sub BD/-distributions of all processes that affect the breakdown statistics becomes even meaningless. For ultra-thin oxides, the impact of different processing conditions requires constant gate voltage instead of constant current density Q/sub BD/-tests.
机译:结果表明,恒定电流Q / sub BD /以评估过程变化对MOS结构可靠性的影响可能导致错误的结论。对于固定的厚度,影响破坏统计信息的所有进程的Q / Sub BD / -Distimutions的比较变得毫无意义。对于超薄氧化物,不同加工条件的影响需要恒定的栅极电压而不是恒定电流密度Q /亚BD / -Tests。

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