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The analysis of horizontal current bipolar transistor (HCBT): a novel silicon bipolar device

机译:水平电流双极晶体管(HCBT)的分析:一种新型硅双极装置

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A new concept of silicon bipolar transistor technology is proposed. The resulting horizontal current bipolar transistor (HCBT) was simulated assuming the 1 /spl mu/m technology. The surface of the device is at least one order of magnitude smaller than conventional SST devices with the same emitter area. The same doping profile as in known vertical current devices is achieved by simpler technology using single polysilicon layer, without conventional epitaxial and n/sup +/ buried layers and with reduced number of lithography masks and technological steps. The electrical analysis of HCBT results in maximum small signal current gain of 158, and maximum cutoff frequency of 16 GHz at U/sub CE/=3 V.
机译:提出了一种新的硅双极晶体管技术的概念。假设1 / SPL MU / M技术模拟所得到的水平电流双极晶体管(HCBT)。该装置的表面比具有相同发射极区域的传统SST设备小的至少一个数量级。通过使用单个多晶硅层的更简单技术实现与已知垂直电流装置中的相同掺杂曲线,而无需常规外延和N / SUP + /掩埋层,并且具有减少的光刻掩模和技术步骤。 HCBT的电气分析导致最大的小信号电流增益为158,最大截止频率为U / Sub CE / = 3 V.

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