High Strain Rate Properties of SAC305 Alloy at Cold Temperatures Subsequent to 100°C Storage for Periods up to 120 Days

摘要

In the fields such as aerospace applications, medical applications and oil/gas production, electronic components may be exposed to extreme cold temperatures. These electronic packages and assemblies can also induce shakes, shocks and impacts. The higher strain rates of 1 to 100 per second and the low temperature of the atmosphere down to -65°C will impact electronic components within such an extreme surrounding. Records for lead free solder alloys measured at cooled working temperatures and high strain rates of thermal ageing are not available. The effects of the previously mentioned SAC305 lead free solder alloys are limited to low strain rates and high working temperatures. Records are not available for SAC305 solder at low operating temperatures. In this paper lead free solder alloy SAC305 was studied and analyzed at various lower surrounding temperatures, beginning at -65°C to 0°C, at high strain rates, and isothermally aged for up to 120 days at 100°C. After reflowing, the prepared SAC305 solder alloy sample were stored for thermal ageing and then tested at 10, 35, 50 and 75 per sec strain rates at operating temperatures from -65°C to 0°C. Stress strain curves are made for different low operating temperatures and different strain rates. The calculated experimental findings of SAC305 were compared with the Anand Viscoplasticity model. The findings of the experiment were consistent with Anand Viscoplasticity model and the Anand constants were calculated by estimating stress-strain reactions at various low temperatures and high strain rates for aging up to 120 days.