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Evaluation of Interfacial Bonding Strength of Films

机译:薄膜界面粘合强度的评价

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Bonding strength is an important property of coating layers and the scratch method is widely used for its evaluation. However, the resistance against one stroke for exfoliating the coating layer is a load bearing capacity rather than bonding strength. A continuous indentation machine with an acoustic emission attachment was designed to detect the initiation of film peeling and the critical value was named Pc. Experiments show that even Pc is closely reated to the smaple hardness, its data are of less deviation and more sensitive to the interfacial condition than the Lc value of scratch test. A better way to evaluate bonding strength is by using contact rolling. Delamination of film occurs after millions of cycles thus stress can be kept in the elastic regime. Under this circumstance, Hertzian analysis can be used to calculate the stress responsible for the peeling of the film. Either cylindrical or spherical contact can be selected for measurement. Since stress concentration is eliminated for ball rolling, the shear stress range at the depth of interface can be precisely determined. The bonding strengths of different coating systems and different film thicknesses can be compared.
机译:粘合强度是涂层层的重要性质,并且划痕法广泛用于其评估。然而,对剥离涂层的一种行程的阻力是负载承载能力而不是粘合强度。设计具有声发射附件的连续压痕机以检测薄膜剥离的启动,并且临界值被命名为PC。实验表明,即使是PC与婴儿硬度密切紧密地升压,其数据比划痕试验的LC值较小,对界面条件更少于偏差和更敏感。通过使用接触轧制来评估粘合强度的更好方法。在数百万个循环之后发生膜的分层因此应在弹性状态下保持应力。在这种情况下,赫兹分析可用于计算负责薄膜剥离的压力。可以选择圆柱形或球形接触以进行测量。由于球轧消除了应力浓度,因此可以精确地确定接口深度处的剪切应力范围。可以比较不同涂层系统和不同膜厚度的粘合强度。

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