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Direct evaluation method of UV curing process on the basis of conductivity change of photopolymerization materials

机译:光聚合材料电导率变化的UV固化过程的直接评价方法

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A novel evaluation methods is proposed for UV curing of photopolymerization materials. The method is based on the measurement of photodecease of the conductivity, which is caused by the photopolymerization of acrylate monomer during the curing process of the ink film. The current changing rate by UV irradiation is in proportion to relative hardness of ink lyer in the surface type cell. The evaluation of sensitivity and curing mechanism of UV curable materials is possible by the measurement of photochange of sample current in either surface or sandwich type cell. The information for non-cured ink layer thickness in the surface type cell can be get from the relationship between the initial thickness and the resistivity of ink layer before UV irradiation. In the case of the sandwich type cell, the curing rate of UV curable resin is in proportion to square root of UV intensity and photoinitiator concentration, respectively. These results satisfy the theoretical equation of the photopolymerization.
机译:提出了一种用于光聚合材料的UV固化的新型评价方法。该方法基于导电性的光腐蚀酶的测量,这是由墨膜的固化过程中丙烯酸酯单体的光聚合引起的。通过紫外线辐射的电流变化率与表面型电池中的墨水裂解器的相对硬度成比例。通过测量任一表面或夹层型细胞中的样品电流的光化,可以评价UV可固化材料的敏感性和固化机制。表面型电池中的非固化油墨层厚度的信息可以从UV照射前的初始厚度和油墨层的电阻率之间的关系获得。在夹层型电池的情况下,UV可固化树脂的固化率分别与UV强度和光引发剂浓度的平方根成比例。这些结果满足了光聚合的理论方程。

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