Diamond Enhanced RF Packaging

摘要

The need for improved thermal management in microelectronics has become a gating factor in the design, packaging and operation of many semiconductor devices and their respective systems. In microelectronics, the "package" is the material system used to protect the device, provide an operating environment and furnish a means of removing heat as well as transporting electrical signals to and from the device. As an enabling packaging material, diamond provides the most effective means of dissipating heast from semiconductors. The required technologies for high performance diamond transistor packages will be discussed, and device performance data presented. The measured transistor data show a 52percent reduction in package thermal impedance compared to an equivalent BeO package. As a result, a nearly 100percent increase in power dissipation can be gained by using a diamond package. This improvement in power is the result of The potential benefits of high performance RF packages for systems improvements will be discussed, as well as future directions for diamond packaging.