On the design of bonded patches for one sided repair

摘要

Due to the load-path eccentricity caused by bonding one reinforcement to only one side of a thin plate, which causes a shift of the neutral plane away from that of the plate, one-sided bonded repair has a much lower repair efficiency thantwo-sided repair It is shown that for a given patch design, the secondary bending not only results in a higher stress intensity factor as compared with two-sided repair, but also significantly increases the stresses in the bonded reinforcement and theadhesive layer. Three non-dimensional parameters have been identified which completely characterise the stress intensity factor, the stresses in the adhesive layer, and the stress distribution in the reinforcement directly above the crack. A parametricstudy shows that one efficient strategy to improve the repair effectiveness and to minimize the stresses in the adhesive layer and the patch is to increase the thickness of the reinforcement.